The global semiconductor packaging market is expected to reach $ 60.44 billion by 2030, up from $ 27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030.


Semiconductor packaging refers to the material that contains a semiconductor device. This case is a case that surrounds the material of the circuit to protect it from corrosion or physical damage and allow the mounting of the electrical contacts connecting it to the printed circuit board (PCB).

New York, August 25, 2021 (GLOBE NEWSWIRE) – announces the publication of the report “Semiconductor Packaging Market by Type, Packaging Material, Wafer Material (Simple Semiconductor and Compound Semiconductor (III-V, II-VI, and IV- IV, and Technology and Industry Vertical: Analysis of Global Opportunities and Industry Forecast, 2021-2030 “-
With the rapid growth of the semiconductor packaging market, especially wafer-level packaging, along with the growing demand for smartphones and devices and the Internet of Things (IoT), packaging vendors are developing process and means reduce the overall cost of advanced packaging and provide maximum operating efficiency. In recent times, packaging is mainly used for high-end products and for applications related to niche markets, such as the production of wafers and dies, due to its high cost of operation.
The major factors driving the growth of the semiconductor packaging market include the growth of Internet of Things (IoT) technology, the high adoption of consumer electronics devices, and the changing trends towards semiconductor wafers in the industry. ‘automobile industry. However, the high cost associated with semiconductor packaging materials is hampering their adoption, which is expected to pose a major threat to the global semiconductor packaging market. However, the changing trends towards packaging at the fan slice level are expected to provide lucrative opportunities for the market growth.
Global semiconductor packaging is segmented into type, packaging material, wafer material, technology, vertical industry and region. Based on the type, the market is divided into flip-chip, integrated chip, WLP fan-in and WLP fan-out. Based on the packaging material, it is analyzed on organic substrate, lead wire, lead frame, ceramic case, die fixing material and others. Based on the wafer material, it is fragmented into single semiconductor and compound semiconductor. The simple semiconductor is further sub-segmented into silicon (Si) and germanium (Ge). The compound semiconductor is further sub-segmented into III-V (gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), gallium phosphide (GaP) and others), II- VI (zinc sulphide (ZnS) and zinc selenide (ZnSe)), and IV-IV (silicon carbide (SiC) and silicon-germanium (SiGe)). On the basis of technology, the market is categorized into Grid Array, Small Boundary Box, Wireless Flat Enclosures (Wireless Dual-flat (DFN) and Wireless Quad-flat (QFN)), Inline Dual Box ( plastic Double In-Line Package (PDIP) and Double In-Line Ceramic Package (CDIP), and others.
By vertical sector, the market is studied in the fields of consumer electronics, automotive, health, IT and telecommunications, aerospace and defense, etc. The automotive segment accounted for the highest market share in 2020, while the consumer electronics segment is expected to grow at the highest CAGR from 2021 to 2030. By region, the semiconductor packaging market trends are analyzed in North America, Europe and Asia-Pacific. , and LAMEA.


• Flip Chip
• Integrated DIE
• Fan-in WLP
• Fan-shaped WLP

• Organic substrate
• Binding wire
• Connection grid
• Ceramics package
• Die fastening material
• Others

• Simple semiconductor
o Silicon (Si)
o Germanium (Ge)
• Compound semiconductor
Gallium arsenide (GaAs)
Indium phosphide (InP)
Gallium nitride (GaN)
Gallium phosphide (GaP)
Zinc sulphide (ZnS)
Zinc selenide (ZnSe)
Silicon Carbide (SiC)
Silicon-Germanium (SiGe)

• Grid table
• Small outline package
• Flat lead-free packages
o Double flat lead free (DFN)
o Quad-flat no-leads (QFN)
• Double package online
o Double In-Line Plastic Packaging (PDIP)
o In-line double ceramic assembly (CDIP)
• Others

• Consumer electronics
• Automotive
• Health care
• IT and telecommunications
• Aerospace and Defense
• Others

• North America
o United States
o Canada
• Europe
o Germany
o France
o Rest of Europe
• Asia Pacific
o China
o South Korea
o Taiwan
o Rest of Asia-Pacific
Latin America
o Middle East and Africa

• Amkor Technology, Inc.
• ASE Group
• ChipMOS Technologies, Inc.
• Powertech Technology, Inc.
• Fujitsu Ltd.
• Company intel
• Texas Instruments
• Jiangsu Changjiang Electronics Technology Co., LTD
• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company
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